发明名称 TRIPLATE LINE SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To simplify processes such as the formation of the radiation element and the relative positioning between a triplate line and a slot, by overcoming the problem that the processes becomes complicated, when a radiation element with a relatively wide width is formed on a tip of the triplate line in order to increase a coupling degree of electromagnetic coupling between the triplate line and a microstrip line. <P>SOLUTION: A backside of a first dielectric layer has an arrangement area in which a second reference conductor is arranged and a non-arrangement area in which the second reference conductor is not arranged. A first reference conductor has an aperture on a position which is opposed to at least part of a triplate line conductor through the first dielectric layer. When an area of the triplate line conductor, which is opposed to the aperture, is set as an opposite area, at least part of an area obtained by projecting the opposite area to the backside of the first dielectric layer is included in the non-arrangement area. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010226279(A) 申请公布日期 2010.10.07
申请号 JP20090069519 申请日期 2009.03.23
申请人 KYOCERA CORP 发明人 KORIYAMA SHINICHI
分类号 H01P5/02;H01P3/08 主分类号 H01P5/02
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