| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power module superior in sealing performance for a board, a semiconductor element, a connection wire, etc. to repetitive vibration at the time of driving the power module and a cooling cycle, which causes no problem of breaking the connection wire, etc. <P>SOLUTION: The semiconductor element 1 is mounted on one side surface of the board (circuit board 2), and a conducting wire 3 connects the board 2 and the semiconductor element 1, in the power module 10. Sealing films 8 are formed at least on the surface of one side surface of the board 2, on the surface of the semiconductor element 1, and on the surface of the conducting wire 3, respectively. <P>COPYRIGHT: (C)2011,JPO&INPIT |
