| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a metal clad laminated plate using a resin composition used for a circuit board having a low elastic modulus, a low stiffness property (flexibility), moisture absorption soldering heat resistance, and the improvement of metal joining reliability by reducing stress generated by heat strain. <P>SOLUTION: In the metal clad laminated plate, metallic foil is formed on an insulating layer 23 and at least at one surface side of the insulating layer 23. In the metal clad laminated plate, a modulus of the elongation of the insulating layer 23 at 25°C is 0.1 GPa or larger and 2 GPa or smaller, and a linear expansion coefficient of the in-plane direction of the insulating layer 23 from 25°C to the glass transition temperature is 20 ppm or larger and 200 ppm or smaller. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
