| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component module in which a shield layer can be formed as a thin film and an electronic component can be surely shielded. SOLUTION: The electronic component module 1 has a plurality of electronic components 12, 13 disposed on a substrate and further covered with an insulating layer. The electronic component module 1 also has a grounding electrode 16 disposed in the substrate, on a side face of the substrate, and an edge portion protruding in a direction substantially orthogonal to the side face of the substrate, below the grounding electrode 16. Further, the electronic component module 1 has the shield layer of 5 to 15 μm in film thickness formed from the insulating layer to an upper surface of the edge portion via the side face of the substrate. COPYRIGHT: (C)2011,JPO&INPIT |
