| 摘要 |
A printed wiring board including resin insulation layers, and conductive circuits formed between the resin insulation layers such that spaces between the conductive circuits are filled with a resin material of the resin insulation layers. The conductor circuits include a first conductive circuit and a second conductive circuit positioned adjacent to the first conductive circuit, each of the first and second conductive circuits has a trapezoidal cross section, and the first and the second conductive circuits satisfy a formula, 0.10T≦̸|W1−W2|≦̸0.73T where W1 represents a width of a space between upper surfaces of the first and second conductive circuits, W2 represents a width of a space between lower surfaces of the first and second conductive circuits, and T represents a thickness of each of the first and second conductive circuit.
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