发明名称 MICRO PIEZORESISTIVE PRESSURE SENSOR AND MANUFACTURING METHOD THEREOF
摘要 A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.
申请公布号 US2010251826(A1) 申请公布日期 2010.10.07
申请号 US20080745745 申请日期 2008.04.21
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 CHOI CHANG AUCK;JE CHANG HAN;HWANG GUNN;KIM YOUN TAE;JUNG SUNG HAE;LEE MYUNG LAE;LEE SUNG SIK;MOON SEOK HWAN
分类号 G01L9/06;H01L41/22 主分类号 G01L9/06
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