| 摘要 |
A method for manufacturing a nozzle plate includes: forming on a first surface of a silicon substrate a film to be a dry etching mask used to form a depression that becomes a first nozzle portion on a droplet discharge side of the silicon substrate, and dry etching the silicon substrate using the film to form the depression to be the first nozzle portion; sequentially forming a first liquid-resistant protective film having liquid resistance and etching resistance and a liquid repellent layer having liquid repellency over the whole of the first surface of the silicon substrate after removing the film used as the dry etching mask, the whole of the first surface including an inner wall of the depression; bonding a support substrate to the first surface of the silicon substrate, and reducing the silicon substrate to a desired thickness from a second surface side opposite from the support substrate; dry etching the silicon substrate from the second surface side until a bottom of the depression to be the first nozzle portion appears, so as to form a second nozzle portion disposed on a droplet supply side and in communication with the first nozzle portion, and to thereby form a nozzle hole from the first nozzle portion and the second nozzle portion; removing the first liquid-resistant protective film and the liquid repellent layer remaining at the bottom of the depression to be the first nozzle portion, and the liquid repellent layer remaining on an inner wall of the first nozzle portion; forming a second liquid-resistant protective film having liquid resistance over the whole of the second surface of the silicon substrate, the whole of the second surface including an inner wall of the nozzle hole; and detaching the support substrate from the silicon substrate.
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