| 摘要 |
<p>The present invention relates to a material mixture for heat treatment of wood, for surrounding the wood with the material mixture for the heat treatment, the material mixture being of a solid state, and comprising - an anti-caking material of at least 5 percent by weight, - a water absorbing/releasing material of at least 20 percent by weight, and - a thermally conductive filling material of an amount necessary for achieving a desired volume of the material mixture and for providing thermal conductivity for the material mixture, the amount being at least 5 percent by weight, wherein - the NaCI content of the material mixture is less or equal than 10 percent by weight. The invention also relates to a wood treatment method with the above material mixture.</p> |
