CURABLE RESIN COMPOSITION AND PRINTED WIRING BOARD

摘要

Disclosed is a curable resin composition which has good workability and high sensitivity, and is capable of providing a cured product thereof with high reliability when the cured product is used, for example, in a printed wiring board or a semiconductor package. Also disclosed is a cured product of the curable resin composition. The curable resin composition contains a photopolymerization initiator and a carboxyl group-containing photosensitive resin which is obtained by reacting a polybasic acid anhydride with a reaction product that is obtained by reacting an unsaturated group-containing monocarboxylic acid with a reaction product that is obtained by reacting a phenol resin having a specific skeleton with an alkylene oxide or a cyclocarbonate compound.