| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus for uniforming the in-plane temperature distribution of a substrate to be preheated by a halogen lamp. SOLUTION: A plurality of bumps 75 are erected on the upper surface of a quartz holding plate 74. A semiconductor wafer W is supported in a horizontal posture at prescribed interval from the upper surface of the holding plate 74 by the plurality of bumps 75. A temperature compensation ring 76 is arranged in a ring shape close to the end edge of the semiconductor wafer W on the upper surface of the holding plate 74, and formed of silicon carbide with infrared absorption higher than quartz. When the semiconductor wafer W is preheated by the halogen lamp, the temperature of the temperature compensation ring 76 also rises, so that heat lost from the end edge of the semiconductor wafer W during preheating is compensated by the temperature compensation ring 76. Consequently, the in-plane temperature distribution of the preheated semiconductor wafer W is uniformed. COPYRIGHT: (C)2011,JPO&INPIT |
