发明名称 MOUNTING STRUCTURE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a mounting structure capable of reliably and sufficiently assuring a state of electrical conduction even when thinning a conductive plate of a frame or the like, or reducing a spacing between a circuit board and the conductive plate. SOLUTION: The mounting structure 100 includes a circuit board 110 with a conductive region G on one side 110A thereof, a conductive plate 120 arranged on an opposite side of the one side of the circuit board and supporting the circuit board, and an elastic member 130 formed of a conductive material, holding respective edges 111 and 121 of the circuit board and the conductive plate by clamping by elastic force. The elastic member includes a first portion 131 extending so as to overlap with the edge from outside of the edge 111 of the circuit board, and pressure-contacting with the conductive region G, a second portion 132 extending so as to overlap with the edge from outside of the edge 121 of the conductive plate, and pressure-contacting with an opposite side to the circuit board, and a connection 133 connecting the first portion and the second portion. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010226001(A) 申请公布日期 2010.10.07
申请号 JP20090073726 申请日期 2009.03.25
申请人 EPSON IMAGING DEVICES CORP 发明人 HAMANO RYO;KISHIDA KEIICHI;SATO KAZUNARI
分类号 H05K9/00;G02F1/1333;H01R4/64 主分类号 H05K9/00
代理机构 代理人
主权项
地址