发明名称 METHOD FOR MANUFACTURING RESIN SUBSTRATE
摘要 A method for manufacturing a resin substrate includes heating a resin sheet including fibers and a resin containing incompletely polymerized molecules to a temperature lower than a polymerization initiation temperature of the resin in order to soften the resin; applying a first pressure to the resin sheet to discharge air bubbles between the fibers outside the resin sheet; decreasing the pressure applied to the resin sheet from the first pressure to a second pressure lower than the first pressure; and heating the resin sheet to the polymerization initiation temperature of the resin or higher to polymerize the molecules of the resin and to discharge a gas generated by the polymerization outside the resin sheet.
申请公布号 US2010255286(A1) 申请公布日期 2010.10.07
申请号 US20100748157 申请日期 2010.03.26
申请人 KYOCERA CORPORATION 发明人 MATSUMOTO KEISAKU;HAYASHI KATSURA
分类号 B32B5/24;B32B37/06;C08L33/24;H05K3/00;H05K3/30 主分类号 B32B5/24
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