发明名称 |
METHOD FOR MANUFACTURING RESIN SUBSTRATE |
摘要 |
A method for manufacturing a resin substrate includes heating a resin sheet including fibers and a resin containing incompletely polymerized molecules to a temperature lower than a polymerization initiation temperature of the resin in order to soften the resin; applying a first pressure to the resin sheet to discharge air bubbles between the fibers outside the resin sheet; decreasing the pressure applied to the resin sheet from the first pressure to a second pressure lower than the first pressure; and heating the resin sheet to the polymerization initiation temperature of the resin or higher to polymerize the molecules of the resin and to discharge a gas generated by the polymerization outside the resin sheet.
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申请公布号 |
US2010255286(A1) |
申请公布日期 |
2010.10.07 |
申请号 |
US20100748157 |
申请日期 |
2010.03.26 |
申请人 |
KYOCERA CORPORATION |
发明人 |
MATSUMOTO KEISAKU;HAYASHI KATSURA |
分类号 |
B32B5/24;B32B37/06;C08L33/24;H05K3/00;H05K3/30 |
主分类号 |
B32B5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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