CONNECTION QUALITY VERIFICATION FOR INTEGRATED CIRCUIT TEST

摘要

An integrated circuit device 100 comprising a semiconductor die contained in a package. The integrated circuit device includes one or more internal connection verification modules 304 for asserting a poor connection signal for the test apparatus in response to a voltage difference between a voltage at a corresponding internal power supply node 120 and a reference voltage, the voltage difference being indicative of a poor connection of power supply to one of power supply terminals 104 on the package. The test apparatus 300, 400 can include an indicator 312 or a sorting element 316 for rejecting or accepting the integrated circuit device 100 in response to logic signals indicative of the presence or absence of a defect accompanied by non-assertion of the poor connection signal, and for processing the integrated circuit device 100 distinctively in response to assertion of the poor connection signal.