Electrical component e.g. press-fit diode, for motor vehicle generator system, has stress-reducing material reducing effect of expansion-or upsetting force on semiconductor substrate by compound layer

摘要

The component i.e. diode (30) has a compound layer (4) for holding a semiconductor substrate (3). A stress-reducing material reduces effect of expansion-or upsetting force on the semiconductor substrate by the compound layer. The semiconductor substrate is connected with a base element (1) by the compound layer. The stress-reducing material is selected from aluminum silicon carbide or from a mixture of molybdenum and copper. The compound layer is made of low-temperature-connecting sinter material. An independent claim is also included for a method for manufacturing an electrical component.