发明名称 SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a solid-state image pickup device less apt to cause color mixture even if an image size is reduced, and also to provide a method for manufacturing the same. <P>SOLUTION: In a rear surface irradiation type solid-state image pickup device 1, a multilayer interconnection layer 13, a semiconductor substrate 20, a plurality of color filters 32, and a plurality of microlenses 33 are provided on a supporting substrate 11 in this order. P-type regions 21 are formed so as to partition a lower layer part of the semiconductor substrate 20 into a plurality of regions to embed insulating members 23 comprising for instance BSG over the p-type regions 21. PD regions 25 are partitioned by the p-type regions 21 and the insulating members 23. High concentration regions 26 are formed in the lower parts of the PD regions 25, and the upper parts are made low concentration regions 27. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010225818(A) 申请公布日期 2010.10.07
申请号 JP20090071038 申请日期 2009.03.23
申请人 TOSHIBA CORP 发明人 MURAKOSHI ATSUSHI
分类号 H01L27/146;H01L27/14;H01L31/10 主分类号 H01L27/146
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