| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a through hole structure for a large current substrate which attains miniaturization and cost reduction, and at the same time, can be manufactured without spending many hours on a manufacturing process, and a method for manufacturing the same. <P>SOLUTION: In the through hole structure for the large current substrate used for a multilayer substrate equipped with a plurality of conductor layers, a plated body 120 which is a part separate from the multilayer substrate is inserted into a through hole, a through hole 11 and the plated body are plated with the same material, both platings electrically conduct each other, opposedly facing surfaces not in contact mutually while each facing mutually exist in inside of the through hole and the surface of the plated body. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
