| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that if a solder ball is mounted far out of a center of a metal layer in forming a bump on an electrode metal layer of a semiconductor substrate, the solder ball is not centered to the center of the metal layer even if reflow is applied by heat treatment. SOLUTION: When a metal layer 41 is formed on an electrode pad 2 of a semiconductor substrate 1, a plurality of groove portions 42 are formed so as to radially extend from the center of the metal layer 41 toward the outer periphery thereof, and in addition, so that the width thereof tapers down toward the outer periphery. By utilizing the groove portion 42 formed in the metal layer 41 as a guide, even in the case where a solder ball 6 is mounted far out of the center of the metal layer 41, if reflow is applied by heat treatment, the solder ball 6 can be surely centered to the center of the metal layer 41. COPYRIGHT: (C)2011,JPO&INPIT |
