| 摘要 |
PROBLEM TO BE SOLVED: To prevent displacement of a surface-mounted component in a surface mounting process. SOLUTION: This invention relates to a method of mounting a surface-mounted component 10 on a board 20. The surface-mounted component 10 includes a body 11 and a plurality of terminals 13. The board 20 includes a wiring part 25, and a second insulating layer 22 laminated on the wiring part 25 and formed with a plurality of through-holes 23 for exposing the wiring part 25. The surface mounting method includes a plating step, a solder application step, a component mounting step, and a solder melting step. In the solder application step, cream solder 40 is applied onto plating parts 30 to project from the upper surface 24 of the second insulating layer 22. In the component mounting step, the surface-mounted component 10 is mounted on the board 20 so that the terminals 13 are arranged on the cream solder 40 after the application. In the solder melting step, the cream solder 40 is melted after the mounting. COPYRIGHT: (C)2011,JPO&INPIT
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