| 摘要 |
<p>An embodiment of the invention includes a device comprising a plurality of nanoparticles and a noble metal film comprising a first side and a second side, the plurality of nanoparticles being located on the second side of said metal film. The device also includes a binding sample contacting the second side of said metal film and a light- sensitive, semiconductor detector array located at a distance less than 200 nanometers from the first side of the metal film.</p> |
