发明名称 THERMALLY EXPANDABLE MICROCAPSULE AND FOAM MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide thermally expandable microcapsules which have excellent thermal resistance and can achieve a high expansion ratio, and can therefore be suitably used in kneading molding added with strong shear force, calendering, extrusion molding, injection molding and the like; and to provide a foam molded product using the thermally expandable microcapsules. SOLUTION: The thermally expandable microcapsules includes a shell composed of a polymer which contains a volatile inflating agent, as a core agent. The shell is composed of a polymer obtained by polymerizing a monomer composition containing: 30-40 wt.% polymerizable monomer (I) composed of acrylonitrile and methacrylonitrile; 30-50 wt.% 3-8C radically polymerizable unsaturated carboxylic acid monomer (II) having a carboxyl group;≥0.1 wt.% polymerizable monomer (III) having two or more double bonds in the molecule; and a polymerizable monomer (IV) having a solubility parameter of the homopolymer of not greater than 10. The content of the acrylonitrile in the polymerizable monomer (I) is 10-60 wt.%, and the monomer composition contains 0.1-10 pts.wt., based on 100 pts.wt. of all the monomer components, metal cation salt capable of forming an ionic bond to the 3-8C radically polymerizable unsaturated carboxylic acid monomer (II) having a carboxyl group. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010222407(A) 申请公布日期 2010.10.07
申请号 JP20090068694 申请日期 2009.03.19
申请人 SEKISUI CHEM CO LTD 发明人 KAWAGUCHI YASUHIRO;KOSAKA YOSHIYUKI
分类号 C09K3/00;C08F120/04;C08J9/32 主分类号 C09K3/00
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