| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a semiconductor device, the method uniformly forming a film on a wafer by suppressing a jump phenomenon of the wafer, suppressing degradation of a yield and productivity, and improving reliability of a semiconductor device. SOLUTION: In the method for manufacturing a semiconductor, a wafer w to be subjected to film formation processing is introduced into a reactor; the wafer is supported to be separated from a support member for mounting the wafer w thereon in the film formation processing; the wafer is preliminarily heated while rotating the support member at a predetermined rotational speed with the wafer separated from the support member; the wafer is mounted on the support member; and a process gas is supplied onto the wafer while the wafer is heated at a predetermined temperature and rotated. COPYRIGHT: (C)2011,JPO&INPIT
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