| 摘要 |
An electronic device includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first electronic component, a first sealing resin, and a first multilayer interconnection structure including a first interconnection pattern directly connected to a first electrode pad of the first electronic component. The second semiconductor device includes a second electronic component, a second sealing resin, and a second multilayer interconnection structure including a second interconnection pattern directly connected to a second electrode pad of the second electronic component. The first semiconductor device is stacked on and bonded to the second semiconductor device through an adhesive layer with the first multilayer interconnection structure of the first semiconductor device facing toward the second sealing resin of the second semiconductor device. The first interconnection pattern and the second interconnection pattern are connected through a through electrode provided through the adhesive layer and the second sealing resin.
|
