发明名称 |
Main board and system for memory mounting test |
摘要 |
A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.
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申请公布号 |
US2010257416(A1) |
申请公布日期 |
2010.10.07 |
申请号 |
US20100662015 |
申请日期 |
2010.03.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JUNG-KUK;LEE SEUNG-HEE |
分类号 |
G11C29/08;G06F11/26;G06F13/14 |
主分类号 |
G11C29/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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