发明名称 Main board and system for memory mounting test
摘要 A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.
申请公布号 US2010257416(A1) 申请公布日期 2010.10.07
申请号 US20100662015 申请日期 2010.03.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE JUNG-KUK;LEE SEUNG-HEE
分类号 G11C29/08;G06F11/26;G06F13/14 主分类号 G11C29/08
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