PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, MULTILAYER PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE

摘要

Provided is a method of manufacturing a printed circuit board having through-holes in the core layer thereof, said method being capable of decreasing printed circuit board warpage, increasing semiconductor chip mounting yield, and improving the reliability of semiconductor packaging. This method is characterized by the inclusion of: a process to irradiate one side of the aforementioned core layer with a laser, at the locations on the core layer where through-holes are to be formed; and a process to irradiate the same locations on other side of the core layer with a laser.