发明名称 PATTERN FORMING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a pattern forming method which can suppress generation of pattern defects when pattern is formed on a substrate. <P>SOLUTION: The pattern forming method includes: steps S1 and S2 of determining an amount of curable resin to be formed on the substrate, the curable resin having volatility; a step S3 of forming the curable resin having the determined amount on the substrate; a step S4 of filling the pattern with the curable resin by the contacting the curable resin formed on the substrate with a template in which the pattern is formed; a step S4 of curing the curable resin under a condition where the curable resin is in contact with the template; a step S4 of separating the template from the cured curable resin to form the pattern in the cured curable resin; a step S4 of forming the pattern on the substrate based on the pattern formed in the curable resin. In the step S2 of determining the amount of the curable resin, the amount of the curable resin is determined by a calculation considering volatile loss of the curable resin. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010225693(A) 申请公布日期 2010.10.07
申请号 JP20090069044 申请日期 2009.03.19
申请人 TOSHIBA CORP 发明人 KOSHIBA TAKESHI;NAKASUGI TETSUO;YONEDA IKUO
分类号 H01L21/027;B29C59/02;G03F7/20 主分类号 H01L21/027
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