BONDED BODY AND METHOD FOR MANUFACTURING SAME

摘要

A method for manufacturing a bonded body includes: an alignment step wherein an anisotropic conductive film is disposed on a first electrode region formed on a substrate, in a state wherein one end of the film protrudes toward further outside of the substrate than the inner edge of the chamfered portion of the substrate or in a state wherein the end is positioned on the inner edge of the chamfered portion, then, on a wiring board, which has a resist region formed on a wiring material with a part thereof covered with a resist layer, and a second electrode region not covered with the resist layer, an resist region end portion positioned on the boundary to the second electrode region is disposed on the chamfered portion; and an electrode connecting step wherein the second electrode region is covered and the first electrode region and the second electrode region are electrically connected by melting the anisotropic conductive film to flow to the resist region side by heating and pressurizing the anisotropic conductive film from the wiring material side.