WIRING STRUCTURE AND METHOD OF FORMING THE SAME

摘要

PURPOSE: A wiring structure and a method for forming the same are provided to reduce the generation of defects during forming processes by forming an additional air gap on the upper sidewall of a conductive pattern. CONSTITUTION: Conductive patterns(114) are formed on a substrate(100). A first interlayer insulating film pattern(102a) is arranged between the conductive patterns. The first interlayer insulating film pattern is spaced apart from the sidewall of the conductive patterns to form a first air gap(116). A second interlayer insulating film pattern(104a) is formed on the first interlayer insulating film. The second interlayer insulating film pattern is spaced apart from the sidewall of the conductive patterns to form a second air gap(118).