| 摘要 |
<p>A semiconductor power module has a support ( 1 ), whereon are formed conductor strips ( 5, 6, 7, 8 ) by applying a structure on an electrically conductive layer ( 3 ) applied on one side ( 2 ) of the support. A semiconductor power module can be manufactured easily and economically enabling several mounting technologies by using a homogeneous base support. Therefore, the conductor strips ( 5, 6, 7, 8 ), as integral elements of the conductor circuit have loose ends ( 6 a, 7 a, 8 a) detached from the side ( 2 ) of the support, the ends of the conductor strips extending outside the support ( 1 ) and forming external connections.</p> |
