COMPOSITION FOR CONDUCTIVE PASTE CONTAINING NANOMETER-THICK METAL MICROPLATES WITH SURFACE-MODIFYING METAL NANOPARTICLES

摘要

PURPOSE: A conductive paste composition is providec to obtain the continuous metallization of silver without requiring nanosilver particle, and to sinter the composition in 150~300 deg C. CONSTITUTION: A conductive paste composition contains 1~8wt% of binder resin, 4~35wt% of solvent, and 60~95wt% of metal nanoparticle modified silver-covered micro plate or a metal nanoparticle modified silver microplate. The metal nanoparticle modified silver microplate or silver covered micro plate has the thickness of 50~200 nanometers.