| 摘要 |
<p>This invention describes an integrated circuit (1) and examples of heat sinks (2) adapted to that circuit. The integrated circuit (1) has legs (6) which are used for the soldering of at least one side of it with the printed circuit board and has a body which is in the shape of a prism. This invention aims to adapt a highly thermal conductive heat sink (2) placed on at least one side surface (4, 4') or on at least one of the upper (3) and lower (5) surfaces along with the side surface.
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