LEAD FRAME FOR LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A lead-frame for a light emitting diode and a method for manufacturing the same are provided to expand a material selection range using a technique complexifying highly conductive materials and highly intensive materials. CONSTITUTION: A circuit pattern(210) is formed on the upper side of a lead-module(200) in order to drive a light emitting diode. A light emitting diode chip(220) is mounted on the upper side of the circuit pattern using a lead-frame(230). A complementary material-based pattern(240) is formed on the surface of the lead-frame. Solder resist(215) is formed on the entire surface of the lead-module in order to protect the circuit pattern and the lead-module. A molding layer(225) including a fluorescent substance is formed on the upper side of the light emitting diode chip.