发明名称 |
PHASE-CHANGEABLE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PURPOSE: A phase-change memory device and a method for manufacturing the same are provided to prevent the contact between an epitaxial film and a nitride film by eliminating the nitride film pattern of an exposed element isolating film. CONSTITUTION: An element isolating film(124) buries a trench formed on the upper side of a substrate(100). An active region(125) is defined by the element isolating film. An interlayer insulating film pattern(135) includes an opening. The opening exposes the active region and the element isolating film. A spacer(140) is formed on the sidewall of the opening. A diode is formed in the opening. A phase-change material layer is in electrical connection with the diode.</p> |
申请公布号 |
KR20100107617(A) |
申请公布日期 |
2010.10.06 |
申请号 |
KR20090025770 |
申请日期 |
2009.03.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, DAE HWAN;PARK, JUNG HOON |
分类号 |
H01L27/115;H01L21/8247 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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