| 摘要 |
PROBLEM TO BE SOLVED: To achieve both miniaturization and heat radiation property appropriately by laminating both semiconductor chips, relating to a mold resin semiconductor device in which two semiconductor chips and a lead member are connected. SOLUTION: The semiconductor device comprises a first semiconductor chip 10, a second semiconductor chip 20, an island 30 having heat dissipation on which both chips 10 and 20 are mounted, a lead 40 which is provided around the island 30 and connected to the chips 10 and 20 through a bonding wire 60, and a mold resin 50 for sealing respective parts. The second semiconductor chip 20 is mounted on one surface 31 of the island 30. A suspension lead 41 around the island 30 is bent to provide a projection 33 projecting upward from one surface 31 of the island 30. The first semiconductor chip 10 is overlapped on the second semiconductor chip 20, while supported on the projection 33. COPYRIGHT: (C)2007,JPO&INPIT |
