Method for producing a plurality of optoelectronic semiconductor components and optoelectronic semiconductor component

摘要

A method for producing a plurality of optoelectronic semiconductor components is disclosed. The method comprises formation of a multi-component composite (18) and separation of the multi-component composite into individual semiconductor components (20). Formation of the multi-component composite (18) comprises providing a carrier body (1) having a chip mounting surface (101) with a plurality of chip mounting regions (2), each chip mounting region (2) being provided for mounting at least one optoelectronic semiconductor chip (4) and being assigned to one optoelectronic semiconductor component (20. Formation of the multi-component composite (18) comprises forming at least two first opaque ridges (3) on the chip mounting surface (101), the two first ridges (3) laterally sandwiching at least one chip mounting region (2). Separation of the multi-component composite (18) into individual semiconductor components (20) comprises effecting first cuts (15) through the carrier body (1) and the first ridges along a main extension direction of the first opaque ridges (3). In addition, an optoelectronic semiconductor component is disclosed.