INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

摘要

PURPOSE: A package laminated integrated circuit packaging system, and a manufacturing method thereof are provided to prevent the solder ball collapse by increasing the number of wirings between the laminated package and the base package. CONSTITUTION: A substrate(104) having a base opening is offered. An encapsulation is formed to surround an integration circuit(208) equipped with an exposed active surface(216) and a non-active surface(218). A hole(224) is formed between a first surface(220) and a second surface(222) through the encapsulation unit.