| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for detecting a defective substrate which treat a wafer as a failure substrate only when the wafer has a defect whose size is too large to ignore at the clamping position of the wafer. SOLUTION: This apparatus comprises a photoelectric detector 8 for detecting whether the rotating wafer W has the defect in the periphery thereof or not; a defect information acquiring means 18 for acquiring the defect information by this detector in the circumferential direction from the reference position in the periphery of the substrate; a means 28 for comparing the acquired defect information with the known scheduled clamping position information 26, in the substrate circumferential direction stored in a memory 19 beforehand; a means 29 for judging as substrate failure (defective substrate) when it is judged that the defect exists in the clamping range for each scheduled clamping position as a result of the comparison by the comparing means, and when the circumferential length of the defect is longer than the clamping range or when the number of the defects in the same clamping range is not less than two; and a means 35 for removing the substrate judged as substrate failure. COPYRIGHT: (C)2007,JPO&INPIT |
