| 发明名称 |
CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE |
| 摘要 |
<p>A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive.</p> |
| 申请公布号 |
EP2237650(A1) |
申请公布日期 |
2010.10.06 |
| 申请号 |
EP20080839429 |
申请日期 |
2008.10.08 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TATSUZAWA, TAKASHI;KOBAYASHI, KOUJI;ITO, AKIHIRO;YOKOZUMI, TOMOMI |
| 分类号 |
H05K1/14;H01B1/22;H01R11/01 |
主分类号 |
H05K1/14 |
| 代理机构 |
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代理人 |
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