发明名称 |
Integrated 3-axis field sensor and fabrication methods |
摘要 |
<p>A multi-axis magnetic or other field sensing device and method of fabricating a multi-axis magnetic or other field sensing device. An example sensing device is a 3-axis sensor package on a substrate with sensors on opposing sides of the substrate. One side of the substrate includes an X-axis sensor and a Y-axis sensor (or alternatively an integrated X-Y-axis sensor) and the opposite side of the substrate includes a Z-axis sensor on at least one sloped surface, the surface sloped with respect to both the first and second surface areas. One surface is mechanically and electrically bonded to a circuit board via conductive bumps (38). The other surface electrically connects to the circuit board (60) through bonded wires (40) and/or vias (112) formed through the substrate.
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申请公布号 |
EP2053415(A3) |
申请公布日期 |
2010.10.06 |
申请号 |
EP20080166849 |
申请日期 |
2008.10.16 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
RIEGER, RYAN W.;WAN, HONG;PECZALSKI, ANDRZEJ |
分类号 |
G01R33/02;G01R33/00 |
主分类号 |
G01R33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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