发明名称 Modular flooring assemblies
摘要 A modular flooring assembly 10 comprising a tray substrate 100 comprising a flooring component 600 adhered thereto; the tray substrate 800 having upward tabs 810 and downward tabs 820 that may be interconnected with upward and downward tabs of a second tray substrate to form a modular floor. The upward and downward tabs comprise grout holes 815, 825 that receive a grout member [900, fig. 25]. The tabs are provided around the perimeter of the tray substrate, with both upward and downward tabs provided on each side of the tray substrate. The grout holes of the upward and downward tabs may overlap when the tray substrate interconnects with another. The grout holes may also comprise brackets 855, 865, and the grout members may comprise a plurality of legs [910, fig. 25] that expand into a plurality of barbs [930, fig. 25], wherein the barbs slide beneath the brackets. The grout member may end in a point formed by a 90 degree angle [952, fig. 28].
申请公布号 GB2467472(B) 申请公布日期 2010.10.06
申请号 GB20100007366 申请日期 2006.10.03
申请人 COMC LLC 发明人 JONATHAN MCINTOSH;NICOLE C SPERLING
分类号 E04F15/024;E04F15/02 主分类号 E04F15/024
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