| 摘要 |
PURPOSE: A substrate treating apparatus is provided to improve the uniform of a process by selectively opening discharge holes on an exhaust plate. CONSTITUTION: A reaction chamber(10) provides a closed space by isolating an object from the outside. A plate supporting plate(12) which is protruded to an exhaust plate(30) is formed on the bottom of the reaction chamber. An exhaust duct(15) is interposed between the discharge plate and the reaction chamber. A plurality of exhaust holes(31) are penetrated into the exhaust plate towards the exhaust duct. At least one first pinhole(51) is formed on at least one of the exhaust plate and the reaction chamber.
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