发明名称 HEAT PUMP SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a heat pump system capable of continuously performing heat load processing by a circuit where a secondary refrigerant is made to circulate even when supply of heat from a circuit where a primary refrigerant is made to circulate to the circuit where the secondary refrigerant is made to circulate is lowered. SOLUTION: A heat pump circuit 10 includes a low-stage side compressor 21, a high-stage side compressor 25, an expansion valve 5a and an outdoor heat exchanger 4. A heating circuit 60 in which water as a secondary refrigerant for heating is made to circulate includes a heating bypass passage 69, a heating tank 9 and a radiator 61. During normal operation control, a control section 11 stores heat in the heating tank 9 while releasing heat in the radiator 61 without making the secondary refrigerant for heating flow in the heating bypass passage 69. During defrosting operation control for fully opening the expansion valve 5a, the control section 11 makes the secondary refrigerant for heating flow in the heating bypass passage 69 and releases heat in the radiator 61 by using the heat stored in the heating tank 9. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010216686(A) 申请公布日期 2010.09.30
申请号 JP20090061903 申请日期 2009.03.13
申请人 DAIKIN IND LTD 发明人 OKUDA NORIYUKI;FUJIMOTO SHUJI;YOSHIMI ATSUSHI;YAMADA TAKUO
分类号 F25B1/00;F25B1/10;F25B30/02;F25B47/02 主分类号 F25B1/00
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