发明名称 |
METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL |
摘要 |
Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
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申请公布号 |
US2010246133(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20090415760 |
申请日期 |
2009.03.31 |
申请人 |
APPLE INC. |
发明人 |
SCHMIDT CHAD C.;BLANCO, JR. RICHARD LIDIO;HEIRICH DOUGLAS L.;HILLMAN MICHAEL D.;MORT PHILLIP L.;NIGEN JAY S.;TICE GREGORY L. |
分类号 |
H05K7/20;F28F7/00;H01L21/50;H01L23/40 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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