| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit pattern forming apparatus capable of forming with high adhesion a highly conductive circuit pattern printed by an electrophotographic method on a base material. SOLUTION: The circuit pattern forming apparatus that forms a circuit pattern on the base material includes an adhesive supply unit which delivers an adhesive to apply the adhesive to an area on the base material where the circuit pattern is formed, a circuit pattern printing unit which supplies first conductive metal particles to the area on the base material coated with the adhesive by the adhesive supply unit to print the circuit pattern on the base material by an electrophotographic printing system, and a conductive liquid supply unit which delivers a conductive liquid containing second conductive metal particles or conductive polymers smaller than the first conductive metal particles to apply the conductive liquid to the circuit pattern. COPYRIGHT: (C)2010,JPO&INPIT
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