| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing film which sufficiently suppresses the formation of transfer marks in the adhesive layer when winding up the processing film having a dicing die bonding film consisting of an adhesive layer and a sticky film in a roll. SOLUTION: The wafer processing film 10 has: a sticky film 14 consisting of a long base material film 11 and an adhesive layer 12 formed like a long film on the base material film 11; and an adhesive layer 13 formed like a long film on the adhesive layer 12. The adhesive layer 12 contains a radioactive polymerizable compound and a photoinitiator. The sticky film 14 is not pre-cut in a shape corresponding to a ring frame 20, and the adhesive layer 13 is not pre-cut in a shape corresponding to a semiconductor wafer W. COPYRIGHT: (C)2010,JPO&INPIT
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