| 摘要 |
A method includes: preparing a transfer base material to have repellency against a silicone material- and conductive particle-containing liquid material; applying the liquid material to a transfer base material surface to form a liquid coating, and drying the liquid coating to obtain a bonding film; imparting energy to the bonding film to develop adhesion near a surface thereof, bonding the transfer base material to a first base material, and then separating the transfer and first base materials to transfer the bonding film to the first base material; thereafter imparting energy to the bonding film to develop adhesion near another surface of the bonding film, and bonding the first base material to a second base material to obtain a temporarily bonded structure; and applying pressure to the temporarily bonded structure to finalize the bonding and electrically connect a first terminal and a second terminal via the conductive particles. |
