| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulator film having a low dielectric constant, excellent strength and in which undesirable variations in film thickness can be avoided, and to provide a composition for film forming, which is suitably used for forming the insulator film, and also a semiconductor device equipped with the insulator film. SOLUTION: The composition for film making contains a polymer in which a polymerizable compound having a polymerizable functional group and/or the polymerizable compound is partly polymerized. The polymerizable compound contains a partial structure A including adamantane-like cage structure, and two polymerizable reactive group contributing to a polymerization reaction. The polymerizable reactive group has two ethynyl groups directly bonded to the aromatic ring. The polymerizable compound has a structure of symmetrical bonding of the polymerizable reactive groups centering the partial structure A. COPYRIGHT: (C)2010,JPO&INPIT
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