发明名称 |
E-CHUCK FOR AUTOMATED CLAMPED FORCE ADJUSTMENT AND CALIBRATION |
摘要 |
The present disclosure provides a semiconductor manufacturing method. The method includes performing a first process to a wafer; measuring the wafer for wafer data after the first process; securing the wafer on an E-chuck in a processing chamber; collecting sensor data from a sensor embedded in the E-chuck; adjusting clamping forces to the E-chuck based on the wafer data and the sensor data; and thereafter performing a second process to the wafer secured on the E-chuck in the processing chamber. |
申请公布号 |
US2010248398(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20090412138 |
申请日期 |
2009.03.26 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG JO FEI;WU SUNNY;MOU JONG-I |
分类号 |
H01L21/66;B05C11/00;H01L21/306 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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