发明名称 SHEET PEELING DEVICE AND SHEET PEELING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent the generation of cracks and damage to a adherend caused by the peel-off of adhesion sheets. SOLUTION: A sheet peeling device 10 includes: a support means 11 for supporting a wafer W; a delivery means 12 for delivering a peeling tape PT; a pasting means 14 for pasting the peeling tape PT to the adhesion sheet S pasted to the wafer W; a single-axis robot 16 for relatively moving the peeling tape PT and the wafer W to peel the adhesion sheet S; and a folding means 17 for maintaining a folded posture of the adhesion sheet S to be folded during peeling. The support means 11 includes: an internal table 18 for supporting the wafer W; an external table 19 that is provided outside the internal table 18 and can support the folding means 17; and an adjustment means 20 for relatively moving the internal and external tables 18, 19 to adjust the relative distance between the folding means 17 supported by the external table 19, and the wafer W. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010219467(A) 申请公布日期 2010.09.30
申请号 JP20090067495 申请日期 2009.03.19
申请人 LINTEC CORP 发明人 TAKANO TAKESHI;SUGISHITA YOSHIAKI
分类号 H01L21/683;H01L21/301 主分类号 H01L21/683
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