| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of modifying a printed wiring board that is easily adaptive to remedy for a manufacturing defect of the printed wiring board and design change. SOLUTION: Modification target pads 12a, 12b whose connection destinations should be changed among component mounting pads 12 on the printed wiring board 40 are removed wholly with a diameter larger than a pad diameter to form a hole 18 of predetermined depth ((b), (b')). A resin 19 is charged in the hole 18 to a halfway depth, and pad portions 6 and 7 for component mounting of a repair sheet 10 which has the pad portions 6 and 7 for component mounting, and wire connection portions 8 and 9 such that they are interconnected with wiring are fixed on the resin 19 ((c), (c')). Then solder balls of an LSI are bonded onto the pads 12 for component mounting, and the pad portions 6 and 7 for component mounting, and wires are connected to the wire connection portions 8 and 9. COPYRIGHT: (C)2010,JPO&INPIT |
