发明名称 SUBSTRATE INTEGRATED CAMERA MODULE
摘要 PROBLEM TO BE SOLVED: To reduce overall thickness of a module while preventing a substrate from being deformed even when reducing the thickness of the substrate. SOLUTION: A substrate integrated camera module comprises: a camera module 3 mounted on a flexible substrate 2; electronic components (regulator 6, USB driver IC 7, ROM 8, oscillator 9) mounted on the substrate 2 for externally outputting image data imaged by the camera module 3; and a reinforcing member 5 having higher rigidity than the substrate 2 and mounted on the substrate 2. A height of the reinforcing member 5 on the substrate 2 is lower than the height of the camera module 3 on the substrate 2. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010220000(A) 申请公布日期 2010.09.30
申请号 JP20090065811 申请日期 2009.03.18
申请人 ALPS ELECTRIC CO LTD 发明人 NAKAJIMA TAKASHI;WADA SATOSHI;SAKURAI TOSHIHIRO
分类号 H04N5/225 主分类号 H04N5/225
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